MIL-PRF-19500/557L
4.3.1 Screening (JANHC and JANKC). Screening of die shall be in accordance with MIL-PRF-19500. As a
minimum, die shall be 100-percent probed in accordance with table I, subgroup 2 except test current shall not exceed
20 A.
4.3.2 Gate stress test. Apply VGS = ±30 V minimum for t = 250 µs minimum.
* 4.3.3 Unclamped inductive switching.
a. Peak current (ID) ....................................... rated ID1.
b. Peak gate voltage (VGS) ........................... 10 V dc.
c. Gate to source resistor (RGS) ................... 25 Ω ≤ RGS ≤ 200 Ω.
d. Initial case temperature (TC) ..................... +25°C +10°C, -5°C.
e. Inductance (L) ............................................ 100 µH minimum.
*
f.
Number of pulses to be applied ................. 1 pulse minimum.
g. Pulse repetition rate ................................... None.
4.3.4 Thermal impedance. The thermal impedance measurements shall be performed in accordance with method
3161 of MIL-STD-750 using the guidelines in that method for determining IM, IH, tH, tSW, (and VH where appropriate).
4.4 Conformance inspection. Conformance inspection shall be in accordance with MIL-PRF-19500.
4.4.1 Group A inspection. Group A inspection shall be conducted in accordance with MIL-PRF-19500 and table I
herein. Electrical measurements (end-points) shall be in accordance with the inspections of table I, subgroup 2
herein.
4.4.2 Group B inspection. Group B inspection shall be conducted in accordance with the conditions specified for
subgroup testing in table E-VIA (JANS) and table E-VIB (JAN, JANTX, and JANTXV) of MIL-PRF-19500 and herein.
Electrical measurements (end-points) shall be in accordance with the inspections of table I, subgroup 2 herein.
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