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MIL-PRF-19500-557 Semiconductor Device, Field Effect Transistor, N-Channel, Silicon Types 2N6796, 2N6796U, 2N6798, 2N6798U, 2N6800, 2N6800U, 2N6802, And 2N6802U Jan, Jantx, Jantxv, Jans, Janhc, And JankcThis specification covers the performance requirements for a N-channel, enhancement-mode, MOSFET, power transistor intended for use in high density power switching applications. Three levels of product assurance are provided for each encapsulated device type as specified in MIL-PRF-19500. Two levels of product assurance are provided for each unencapsulated device type.

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. . . . . . . . .
MIL-PRF-19500/557L
* 4.4.2.1 Group B inspection, table E-VIA (JANS) of MIL-PRF-19500.
Subgroup Method
Condition
B3
1051
Test condition G.
*
B4
1042
Test condition D. The heating cycle shall be 1 minute minimum.
Accelerated steady-state operation life; test condition A; VDS = rated TA = +175�C,
B5
1042
t = 120 hours. Read and record V(BR)DSS (pre and post) at 1 mA = ID. Read and
record IDSS (pre and post). Deltas for V(BR)DSS shall not exceed 10 percent and
IDSS shall not exceed 25 �A. Accelerated steady-state gate stress; condition B,
VGS = rated, TA = +175�C, t = 24 hours.
B5
2037
Bond strength (Al-Au die interconnects only); test condition D.
* 4.4.2.2 Group B inspection, table E-VIB (JAN, JANTX, and JANTXV) of MIL-PRF-19500.
Subgroup Method
Condition
B2
1051
Test condition G.
*
B3
1042
Test condition D. The heating cycle shall be 1 minute minimum.
B3
2037
Test condition D. All internal bond wires for each device shall be pulled separately.
* 4.4.3 Group C inspection. Group C inspection shall be conducted in accordance with the conditions specified for
subgroup testing in table E-VII of MIL-PRF-19500 and as follows. Electrical measurements (end-points) shall be in
accordance with the inspections of table I, subgroup 2 herein.
Subgroup
Method
Condition
C2
2036
Test condition E (not required for LCC).
C5
3161
See 4.3.4.
*
C6
1042
Test condition D. The heating cycle shall be 1 minute minimum.
4.4.4 Group E inspection. Group E inspection shall be conducted in accordance with the conditions specified for
subgroup testing in table E-IX of MIL-PRF-19500 and as specified in table II herein. Electrical measurements (end-
points) shall be in accordance with table I, subgroup 2 herein.
4.5 Methods of inspection. Methods of inspection shall be as specified in the appropriate tables and as follows.
4.5.1 Pulse measurements. Conditions for pulse measurement shall be as specified in section 4 of MIL-STD-750.
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