MIL-PRF-19500-586 Semiconductor Device, Diode, Silicon, Schottky Barrier, Types 1N5817-1, 1N5817Ur-1, 1N5819-1, 1N5819Ur-1, 1N6761-1, And 1N6761Ur-1, Jan, Jantx, Jantxv, Jans, Janhc, And JankcThis specification covers the performance requirements for silicon, Schottky barrier diodes. Four levels of product assurance are provided for each encapsulated device types as specified in MIL-PRF-19500. Two levels of product assurance are provided for unencapsulated devices \(die\) as specified in MIL-PRF-19500.

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MIL�PRF�19500/586L

3. REQUIREMENTS

3.1 General. The individual item requirements shall be as specified in MIL�PRF�19500 and as modified herein.

3.2 Qualification. Devices furnished under this specification shall be products that are manufactured by a

manufacturer authorized by the qualifying activity for listing on the applicable qualified manufacturer's list (QML)

before contract award (see 4.2 and 6.3).

3.3 Abbreviations, symbols, and definitions. Abbreviations, symbols, and definitions used herein shall be as

3.4 Interface and physical dimensions. Interface and physical dimensions shall be as specified in

MIL�PRF�19500, and herein. The device package styles are as follows: Axial leaded

DO�204AL (formerly DO�41) in accordance with figure 1 for device types 1N5817�1, 1N5819�1, and 1N6761�1,

DO�213AB (MELF) in accordance with figure 2 for device types 1N5817UR�1, 1N5819UR�1, and 1N6761UR�1, and

unencapsulated die in accordance with figure 3 for device types JANHC and JANKC.

3.4.1 Lead material and finish. Lead material shall be copper clad steel with a minimum of 50 percent copper by

weight. The lead finish shall be solderable in accordance with MIL�STD�750, MIL�PRF�19500, and herein. Where

a choice of lead finish is desired, it shall be specified in the acquisition document (see 6.2).

3.4.2 Polarity. The polarity of all packaged device types shall be indicated with a contrasting color band to denote

the cathode end. Alternatively, for UR suffix devices, a minimum of three contrasting color dots spaced around the

periphery on the cathode end may be used. The polarity of unencapsulated die shall be as identified on figure 3.

3.4.3 Diode construction. All devices shall be metallurgically bonded, double plug construction in accordance with

the requirements of MIL�PRF�19500. All glass diodes shall be designed with sufficient thermal compensation in the

axial direction to optimize tensile and compressive stresses. Dimensional analysis is required of all materials used to

achieve axial thermal compensation. Dimensional tolerances and corresponding coefficient of thermal expansion

(CTE) shall be documented on the DLA Land and Maritime Design and Construction Form 36D and shall be

approved by the qualifying activity to maintain qualification. Dimensional tolerances shall be sufficiently tight enough

to prevent excessive stresses due to the inherent CTE mismatch. The UR suffix devices (DO�213AB) shall be

structurally identical to the non-UR suffix devices except for end-cap lead attachment.