MILPRF19500/586L
3.5 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance
3.6 Electrical test requirements. The electrical test requirements shall be as specified in table I herein.
3.7 Marking.
3.7.1 Axial lead devices. Marking shall be in accordance with MILPRF19500. Manufacturer's identification and
date code shall be marked on the devices. Initial container package marking shall be in accordance with
MILPRF19500. The polarity shall be indicated with a contrasting color band to denote the cathode end. The
prefixes JAN, JANTX, JANTXV, and JANS may be abbreviated as J, JX, JV, and JS respectively. Manufacturer's
identification and date code shall be marked on the devices. The part number may be reduced to J5817, JX5817,
JV5817, or JS5817. Color coding shall not be permitted for part numbering.
3.7.2 MELF surface mount devices (UR versions). For UR suffix devices only, all marking, except polarity may be
omitted from the body, but shall be retained on the initial container.
3.8 Workmanship. Semiconductor devices shall be processed in such a manner as to be uniform in quality and
shall be free from other defects that will affect life, serviceability, or appearance.
4. VERIFICATION
4.1 Classification of inspections. The inspection requirements specified herein are classified as follows:
a.
Qualification inspection (see 4.2).
b.
Screening (see 4.3).
c.
4.2 Qualification inspection. Qualification inspection shall be in accordance with MILPRF19500 and as specified
herein.
4.2.1 Group E qualification. Group E inspection shall be performed for qualification or re-qualification only. In
case qualification was awarded to a prior revision of the specification sheet that did not require the performance of
table II tests, the tests specified in table II herein that were not performed in the prior revision shall be performed on
the first inspection lot of this revision to maintain qualification.
4.2.2 Qualification of unencapsulated die (JANHC and JANKC devices). Qualification inspection for
unencapsulated die shall be in accordance with appendix G of MILPRF19500. This qualification testing may be
performed with the die mounted in a TO5 package in lieu of the DO41 axial leaded package.
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