MIL-PRF-19500/587E
4.4.4 Group E inspection. Group E inspection shall be conducted in accordance with the conditions specified for
subgroup testing in appendix E, table E-IX of MIL-PRF-19500 and as specified herein. Electrical measurements
(end-points) and delta limits shall be in accordance with table II herein; except, ZθJX need not to be performed.
4.5 Methods of inspection. Methods of inspection shall be as specified in the appropriate tables as follows.
4.5.1 Pulse measurements. Conditions of pulsed measurements shall be specified in section 4 of MIL-STD-750.
4.5.2 Scope display evaluation. The reverse breakdown characteristics shall be viewed on an oscilloscope with
display calibration factors of 20 µA per division and 50 or 100 V per division as applicable. Reverse current over the
knee shall be at least 100 µA and less than 200 µA. Any discontinuity or dynamic instability of the trace shall be
cause for rejection of that device.
4.5.3 Burn-in and life tests. These tests shall be conducted with a half-sine waveform of the specified peak voltage
impressed across the diode in the reverse direction followed by a half-sine waveform of the specified average
rectified current. The forward conduction angle of the rectified current shall be neither greater than 180 degrees, nor
less than 150 degrees.
4.5.3.1 Free air burn-in. The use of a current limiting or ballast resistor is permitted provided that each DUT still
sees the full required TJ and IO and that the minimum required voltage, where applicable, is maintained through out
the burn-in period. Use method 3100 of MIL-STD-750 to measure TJ. TJ = 135°C minimum for screening and 150°C
for life tests.
4.5.4 Thermal resistance. Thermal resistance measurement shall be performed in accordance with method 4081
of MIL-STD-750 using the guidelines in that method for determining IM, IH, tSW and tH (VC and VH where
appropriate). Measurement delay time tMD = 70 µs max. See MIL-PRF-19500, table E-IX, subgroup 4. Forced
moving air or draft shall not be permitted across the devices during test.
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