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MIL-PRF-19500-614 Semiconductor Device, Field Effect Radiation Hardened Transistors, N-Channel, Silicon, Types 2N7380 And 2N7381, Jantxv, M, D, R, F, G, And H And Jans, M, D, R, F, G, And HThis specification covers the performance requirements for an N-channel, radiation hardened, enhancement mode, MOSFET, power transistors intended for use in high density power switching applications. Two levels of product assurance are provided for each device type as specified in MIL-PRF-19500, with avalanche energy ratings \(EAS\) and maximum avalanche current \(IAS\). See 6.5 for JANHC and JANKC die versions.

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MIL-PRF-19500/614J
4.4.2 Group B inspection. Group B inspection shall be conducted in accordance with the conditions specified for
subgroup testing in table E-VIA (JANS) and table E-VIB (JANTXV) of MIL-PRF-19500, and as follows. Electrical
measurements (end-points) shall be in accordance with table I, subgroup 2 herein.
* 4.4.2.1 Group B inspection, table E-VIA (JANS) of MIL-PRF-19500.
Subgroup
Method
Condition
B3
1051
Condition G.
B4
1042
The heating cycle shall be 1 minute minimum.
Condition A; VDS = 100 percent of rated; TA = +175°C, t = 120 hours or TA = +150°C,
B5
1042
t = 240 hours; read and record VBR(DSS) (pre and post) at ID = 1 mA; read and record
IDSS (pre and post), in accordance with table I, subgroup 2.
Condition B; VGS = 100 percent of rated TA = +175°C, t = 24 or TA = +150°C,
B5
1042
t = 48 hours.
4.4.2.2 Group B inspection, table E-VIB (JANTXV) of MIL-PRF-19500.
Subgroup
Method
Condition
B2
1051
Condition G.
B3
1042
The heating cycle shall be 1 minute minimum.
* 4.4.3 Group C inspection. Group C inspection shall be conducted in accordance with the conditions specified for
subgroup testing in table E-VII of MIL-PRF-19500, and as follows. Electrical measurements (end-points) shall be in
accordance with table I, subgroup 2 herein.
Subgroup
Method
Condition
C2
2036
Test condition A, weight = 10 lbs, t = 10 seconds.
See 4.3.3, RθJC(max) = 1.67°C/W
C5
3161
C6
1042
The heating cycle shall be 1 minute minimum. No heat sink nor forced air
cooling on the device shall be permitted.
4.4.4 Group D Inspection. Group D inspection shall be conducted in accordance with appendix E, table E-VIII of
4.4.5 Group E inspection. Group E inspection shall be conducted in accordance with the conditions specified for
subgroup testing in appendix E, table E-IX of MIL-PRF-19500 and as specified herein. Electrical measurements
(end-points) shall be in accordance with table I, subgroup 2 herein.
4.5 Methods of inspection. Methods of inspection shall be as specified in appropriate tables and as follows.
4.5.1 Pulse measurements. Conditions for pulse measurements shall be as specified in section 4 of
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