MIL-PRF-19500/614J
3.9 Workmanship. Semiconductor devices shall be processed in such a manner as to be uniform in quality and
shall be free from other defects that will affect life, serviceability, or appearance.
4. VERIFICATION
4.1 Classification of inspections. The inspection requirements specified herein are classified as follows:
a. Qualification inspection (see 4.2).
b. Screening (see 4.3).
4.2 Qualification inspection. Qualification inspection shall be in accordance with MIL-PRF-19500 and as specified
herein.
4.2.1 Group E qualification. Group E inspection shall be performed for qualification or re-qualification only. In
case qualification was awarded to a prior revision of the specification sheet that did not request the performance of
table III tests, the tests specified in table III herein that were not performed in the prior revision shall be performed on
the first inspection lot of this revision to maintain qualification.
4.2.1.1 Single event effects (SEE). SEE shall be performed at initial qualification and after process or design
changes which may affect radiation hardness (see table III and table IV). Upon qualification, manufacturers shall
provide the verification test conditions from section 5 of method 1080 of MIL-STD-750 that were used to qualify the
device for inclusion into section 6 of the slash sheet. End-point measurements shall be in accordance with table II.
SEE characterization data shall be made available upon request of the qualifying or acquiring activity.
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