MIL-PRF-19500/276H
* 4.4.2.2 Group B sample selection. Samples selected from group B inspection shall meet all of the following
requirements:
a. For JAN, JANTX, and JANTXV samples shall be selected randomly from a minimum of three wafers (or from
each wafer in the lot) from each wafer lot.
b. Shall be chosen from an inspection lot that has been submitted to and passed table I, subgroup 2, conformance
inspection. When the final lead finish is solder or any plating prone to oxidation at high temperature, the
samples for life test group B for JAN, JANTX, and JANTXV may be pulled prior to the application of final lead
finish.
c. Separate samples may be used for each step. In the event of a group B failure, the manufacturer may pull a
new sample at double size from either the failed assembly lot or from another assembly lot from the same wafer
lot. If the new assembly lot option is exercised, the failed assembly lot shall be scrapped.
4.4.3 Group C inspection. Group C inspection shall be conducted in accordance with the conditions specified for
subgroup testing in appendix E, table VII of MIL-PRF-19500. Electrical measurements (end-points) shall be in
accordance with the applicable steps of table II herein.
4.4.3.1 Group C inspection, appendix E, table VII of MIL-PRF-19500.
Subgroup
Method
Conditions
C2
2036
Condition E. Not applicable for U4 devices.
L = .375 inch (9.53 mm), RΘJL = 250°C/W maximum; RΘJEC = 100°C/W;
* C5
3181
RΘJSP =120°C/W; (see 4.3.2), 22 devices, c = 0.
C6
1037
Not applicable.
4.5 Methods of inspection. Methods of inspection shall be as specified in the appropriate tables and as follows.
4.5.1 Pulse measurements. Conditions for pulse measurement shall be as specified in section 4 of MIL-STD-750.
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