MIL-PRF-19500/411R
4.4.3 Group C inspection. Group C inspection shall be conducted in accordance with the conditions specified for
subgroup testing in appendix E, table E-VII of MIL-PRF-19500. End-point electrical measurements shall be in
accordance with table I, subgroup 2 herein. Delta measurements shall be as specified in table IV herein.
* 4.4.3.1 Group C inspection, appendix E, table E-VII of MIL-PRF-19500.
Subgroup
Method
Condition
*
C2
2036
Tension: Test condition A; weight = 20 lbs, t = 15 seconds.
Lead Fatigue: Test condition E; weight = 2 lbs. (non US devices)
*
2038
Tab Pull: Test condition B; weight = 20 pounds, t = 15 seconds. (US devices)
C5
4081
For surface mount devices (US version), RθJEC = 6.5°C/W maximum.
C6
1026
IO = 3 A minimum; and adjust IO or TA to achieve the required TJ; apply
(max). For irradiated devices, include trr as an end-point measurement.
4.4.4 Group D inspection. Radiation hardness assured JANS and JANTXV devices shall include the group D tests
specified in table II herein. These tests shall be performed as required in accordance with MIL-PRF-19500 and
method 1019 of MIL-STD-750 for total ionizing dose or method 1017 for neutron fluence as applicable.
4.4.5 Group E inspection. Group E inspection shall be conducted in accordance with the conditions specified for
subgroup testing in appendix E, table E-IX of MIL-PRF-19500 and as specified herein. Electrical measurements
(endpoints) shall be in accordance with table I, subgroup 2 herein. See table IV for delta limits when applicable.
4.5 Methods of inspection. Methods of inspection shall be as specified in the appropriate tables and as follows.
4.5.1 Pulse measurements. Conditions for pulse measurement shall be as specified in section 4 of MIL-STD-750.
4.5.2 Scope display evaluation. Scope display evaluation shall be stable in accordance with method 4023 of
MIL-STD-750. Scope display may be performed on ATE (automatic test equipment) for screening only, with the
approval of the qualifying activity. Scope display in group A shall be performed on a scope. The reverse current (IBR)
over the knee shall be 500 µA peak.
4.5.3 Burn-in and life tests. These tests shall be conducted with a half-sine waveform of the specified peak voltage
impressed across the diode in the reverse direction followed by a half-sine waveform of the specified average
rectified current. The forward conduction angle of the rectified current shall be neither greater than 180 degrees, nor
less than 150 degrees.
4.5.3.1 Free air burn-in and life tests. The use of a current limiting or ballast resistor is permitted provided that
each DUT still sees the required TJ and IO, and that the minimum required voltage, where applicable, is maintained
through-out the burn-in period. Use method 3100 of MIL-STD-750 to measure TJ. TJ = 135°C minimum for
screening and 150°C minimum for life tests. TA = 55°C maximum.
4.5.4 Thermal resistance. Thermal resistance measurement shall be performed in accordance with method 4081
of MIL-STD-750 using the guidelines in that method for determining IM, IH, and tH. Measurement delay time tMD =
70 µs max. See MIL-PRF-19500, table E-IX, subgroup 4. Forced moving air or draft shall not be permitted across
the devices during test.
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