MILPRF19500/427P
4.4.4 Group E inspection. Group E inspection shall be conducted in accordance with the conditions specified for
subgroup testing in table IX of MIL-PRF-19500, appendix E, and as specified herein. Electrical measurements (end-
points) shall be in accordance with table I, subgroup 2 herein; except, ZθJX need not be performed. See table III
herein for delta limits when applicable.
4.5 Methods of inspection. Methods of inspection shall be specified in the appropriate tables and as follows.
4.5.1 Pulse measurements. Conditions for pulse measurement shall be as specified in section 4 of MIL-STD-750.
4.5.2 Scope display evaluation. Scope display evaluation shall be sharp and stable in accordance with method
4023 of MIL-STD-750. Scope display may be performed on ATE (automatic test equipment) for screening only with
the approval of the qualifying activity. Scope display in table I, subgroup 4 herein shall be performed on a scope.
Reverse current (IBR) over the knee shall be 500 µA peak.
4.5.3 Burn-in and life tests. These tests shall be conducted with a half-sine waveform of the specified peak voltage
impressed across the diode in the reverse direction followed by a half-sine waveform of the specified average
rectified current. The forward conduction angle of the rectified current shall be neither greater than 180 degrees, nor
less than 150 degrees.
4.5.3.1 Free air burn-in and life tests. The use of a current limiting or ballast resistor is permitted provided that
each DUT still sees the full required TJ and IO and that the minimum required voltage, where applicable, is
maintained through out the burn-in period. Use test method 3100 of MIL-STD-750 to measure TJ. TJ = 135°C
minimum for screening and 150°C minimum for life tests. TA = 55°C maximum.
4.5.4 Thermal resistance. Thermal resistance measurement shall be performed in accordance with method 4081
of MIL-STD-750 using the guidelines in that method for determining IM, IH, and tH. Measurement delay time tMD =
70 µs max. See table E-IX of MIL-PRF-19500, subgroup 4, and figures 5 and 6 herein. Forced moving air or draft
shall not be permitted across the devices during test.
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