MILPRF19500/427P
3. REQUIREMENTS
3.1 General. The individual item requirements shall be as specified in MIL-PRF-19500 and as modified herein.
3.2 Qualification. Devices furnished under this specification shall be products that are manufactured by a
manufacturer authorized by the qualifying activity for listing on the applicable qualified manufacturer's list (QML)
before contract award (see 4.2 and 6.3).
3.3 Abbreviations, symbols, and definitions. Abbreviations, symbols, and definitions used herein shall be as
specified in MIL-PRF-19500 and as follows.
EC
End-cap.
US
Short-body unleaded or surface mounted diodes (square end-caps).
3.4 Interface and physical dimensions. The interface and physical dimensions shall be as specified in
3.4.1 Lead finish. Unless otherwise specified, lead or end cap finish shall be solderable in accordance with
MIL-PRF-19500, MIL-STD-750, and herein. When solder alloy is used for finish, the maximum lead temperature is
limited to 175°C maximum. Where a choice of finish is desired, it shall be specified in the acquisition document (see
6.2).
3.4.2 Diode construction. These devices shall be metallurgically bonded-thermally-matched-noncavity-double plug
construction, utilizing a category I bond, in accordance with MIL-PRF-19500, except for JANHC and JANKC. US
version devices shall be structurally identical to the nonsurface mount version devices except for lead termination.
3.5 Marking. Marking shall be in accordance with MIL-PRF-19500.
3.5.1 Marking of US version devices. For US version devices only, all marking (except as stated
in 3.6) may be omitted from the body, but shall be retained on the initial container.
3.6 Polarity. The polarity of all types shall be indicated with a contrasting color band to denote the cathode end.
Alternatively, for US suffix devices, a minimum of three contrasting color dots spaced around the periphery on the
cathode end or a contrasting color band may be used.
3.7 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance
3.8 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table I,
herein.
3.9 Workmanship. Semiconductor devices shall be processed in such a manner as to be uniform in quality and
shall be free from other defects that will affect life, serviceability, or appearance.
4. VERIFICATION
4.1 Classification of inspections. The inspection requirements specified herein are classified as follows:
a.
Qualification inspection (see 4.2).
b.
Screening (see 4.3).
c.
Conformance inspection (see 4.4).
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