MIL-PRF-19500/429N
4.3 Screening (JANS, JANTX, and JANTXV levels). Screening shall be in accordance with appendix E, table E-IV
of MIL-PRF-19500, and as specified herein. The following measurements shall be made in accordance with table I
herein. Devices that exceed the limits of table I herein shall not be acceptable.
Measurement
Screen (see appendix
E, table E-IV of
JANS level
JANTXV and JANTX level
1a
Required
Not required
1b
Required
Required (JANTXV only)
2
Not required
Not required
3a
Required
Required
Thermal impedance (see 4.3.1)
Thermal impedance (see 4.3.1)
(1) 3c
4
Not applicable
Not applicable
5
Not applicable
Not applicable
6
Not applicable
Not applicable
8
Required
Not required
9
Not required
Required IR1 and VF
10
Method 1038 of MIL-STD-750, condition A
Method 1038 of MIL-STD-750, condition A
IR1 and VF, ĆIR1 ≤ 100 percent of initial
(2) 11
IR1 and VF
reading or ±100 nA dc, whichever is
greater. ĆVF ≤ ±0.1 V dc
12
Required, see 4.3.2
Required, see 4.3.2
(2) (3) 13
Subgroups 2 and 3 of table I herein:
Subgroup 2 of table I herein:
ĆIR1 ≤ 100 percent of initial reading or
ĆIR1 ≤ 100 percent of initial reading or
±100 nA dc, whichever is greater.
±100 nA dc, whichever is greater.
ĆVF ≤ ±0.1 V dc. Scope display
ĆVF ≤ ±0.1 V dc. Scope display
evaluation (see 4.5.4)
evaluation (see 4.5.4)
15
Required
Not required
16
Required
Not required
(1) Thermal impedance shall be performed any time after sealing provided temperature cycling is performed in
accordance with MIL-PRF-19500, screen 3 prior to this thermal test.
(2) For JANTX and JANTXV devices, ΔVF2 may be omitted if thermal impedance is performed, unless irradiation is
used to reduce the carrier lifetime.
(3) ZθJX is not required in screen 13, if already previously performed.
4.3.1 Thermal impedance. The thermal impedance measurements shall be performed in accordance with method
3101 of MIL-STD 750 as applicable, using the guidelines in that method for determining IM, IH, tH, and K factor where
appropriate). Measurement delay time (tMD) = 70 µs max. The thermal impedance limit used in screen 3c and table
I, subgroup 2 shall be set statistically by the supplier.
4.3.2 Free air power burn-in conditions. Power burn-in conditions are as follows (see 4.5.3 and 4.5.3.1): IO(min) =
rated IO (see 1.3 herein); TA = 55°C maximum. Test conditions in accordance with method 1038 of MIL-STD-750,
condition B. Use method 3100 of MIL-STD-750 to measure TJ. Adjust IO or TA to achieve the required TJ. TJ =
135°C minimum. With approval of the qualifying activity and preparing activity, alternate burn-in criteria (hours, bias
conditions, TJ, mounting conditions) may be used for JANTX and JANTXV quality levels. A justification
demonstrating equivalence is required. In addition, the manufacturing site's burn-in data and performance history will
be essential criteria for burn-in modification approval.
4.3.3 Screening (JANHC and JANKC). Screening of die shall be in accordance with appendix G of
MIL-PRF-19500. As a minimum, die shall be 100-percent probed to ensure compliance with table I, subgroup 2.
Burn-in duration for the JANKC level follows JANS requirements; the JANHC follows JANTX requirements.
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