MIL-PRF-19500/444N
* 4.5.3 Decap analysis (for glass packages only). Scribe and break (scribe and break not applicable to UB
packages). Scratch glass at cavity area with diamond scribe. Carefully snap open. Using 30X magnification,
examine the area where die (or bonding material) is in contact with the plugs, verify metallurgical bonding area.
* 4.5.3.1 Decap analysis (for UB packages only). Decap the package. Carefully remove the lid. Using 30X
magnification, examine the area where die (or bonding material) is in mounted to the header, verify wire bond area.
* 4.5.4 Preconditioning for temperature cycling (not applicable to UB packages).
a. Read and record IR1, VF2, and ZθJX. Maintain device serialization throughout testing.
b. Immerse device terminations into any suitable flux. Flux is used to prevent solder bridging across the
terminations of device and to provide for a suitable contact needed for post electrical testing.
c. Immerse device terminations into solder. The devices terminations shall be immersed instantly and not
gradually, and held completely immersed in the solder for 5 +2, -0 seconds. No dwell time over the solder pot
shall be permitted. Maintain solder temperature to +260°C ±5°C.
d. The device shall be allowed to return to ambient prior to cleaning. Remove residue flux from the terminations
by dipping the parts in isopropyl alcohol or other suitable solvent.
e. Test devices to method 1056 and 1051 of MIL-STD-750 and in accordance with MIL-PRF-19500.
f. Read and record IR1, VF2, and ZθJX, test subgroup 2 of table 1 herein.
g. Failure criteria: Subgroup 2 of table 1 herein.
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