MIL-PRF-19500/444N
4.1.1 Sampling inspection. Sampling inspection shall be in accordance with MIL-PRF-19500.
4.2 Qualification inspection. Qualification inspection shall be in accordance with MIL-PRF-19500 and as specified
herein.
4.2.1 Group E qualification. Group E inspection shall be performed for qualification or re-qualification only. In
case qualification was awarded to a prior revision of the specification sheet that did not require the performance of
table II tests, the tests specified in table II herein that were not performed in the prior revision shall be performed on
the first inspection lot of this revision to maintain qualification.
4.2.2 JANHC and JANKC devices. Qualification shall be in accordance with MIL-PRF-19500.
4.3 Screening. Screening shall be in accordance with table E-IV of MIL-PRF-19500 and as specified herein. The
following measurements shall be made in accordance with table I herein. Devices that exceed the limits of table I
herein shall not be acceptable.
Screen
Measurement
(see table E-IV of
JANS
JANTXV and JANTX level
MIL-PRF-19500)
1a
Required
Not required
1b
Required
Required (JANTXV only)
2
Not required
Not required
3a
Required
Required
3b
Not applicable
Not applicable
(1) 3c
Required (see 4.3.3)
Required (see 4.3.3)
4
Required for UB
Not applicable
5
Required for UB
Not applicable
6
Not applicable
Not applicable
8
Required
Not required
9 and 10
Not applicable
Not applicable
Required IR1 and VF1
Required IR1 and VF1
11
12
Required, see 4.3.1
Required. See 4.3.1, t = 48 hours
Required. Subgroup 2 and 3 of table I
Subgroup 2 of table I herein; ĆIR1 ≤ 100
herein; ĆIR1 ≤ 100 percent of initial reading
(2) 13
percent of initial reading or 50 nA
or 25 nA whichever is greater;
whichever is greater; ĆVF1 ≤ ±40 mV dc.
ĆVF1 ≤ ±20 mV dc.
(1) Thermal impedance shall be performed any time after sealing provided temperature cycling is performed in
accordance with table E-IV of MIL-PRF-19500, JANTX and JANTXV levels do not need to be repeated in
screening requirements.
(2) Test within 24 hours after removal from test.
4.3.1 Burn-in conditions. Burn-in conditions are as follows: High temperature reverse bias (HTRB), method 1038
of MIL-STD-750, test condition A, VR = 40 V; TA = +150°C (min) for 1N5711 and 1N6858. VR = 12.8 V,
TA = +150°C (min) for 1N5712 and 1N6857.
4.3.2 Screening (JANHC or JANKC). Screening of JANC die shall be in accordance with MIL-PRF-19500,
"Discrete Semiconductor Die/Chip Lot Acceptance". Burn-in duration for the JANKC level follows JANS
requirements; the JANHC follows JANTX requirements.
4.3.3 Thermal impedance measurements. The thermal impedance measurements shall be performed in
accordance with method 3101 or 4081 of MIL-STD-750, as applicable, using the guidelines in that method for
determining IH and IM. tMD shall be 70 µs maximum, tH shall be 10 ms maximum. See group B inspection, subgroup
6, paragraph 4.4.2.1, group C inspection, subgroup 5, paragraph 4.4.3, and group E, subgroup 4 of table II herein.
9
For Parts Inquires call Parts Hangar, Inc (727) 493-0744
© Copyright 2015 Integrated Publishing, Inc.
A Service Disabled Veteran Owned Small Business