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MIL-PRF-19500-472 Semiconductor Device, Transistor, Npn, Silicon, Power Darlington, Types 2N6350, 2N6351, 2N6352, And 2N6353, Jan, Jantx, Jantxv, Janhc, And JankcThis specification covers the performance requirements for NPN silicon power Darlington, transistors. Three levels of product assurance are provided for each encapsulated device type as specified in MIL-PRF-19500. One level of product assurance are provided for each unencapsulated device type as specified in MIL-PRF-19500.

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MIL­PRF­19500/472F
NOTES:
1.
Chip size:
.087 x .100 inch ±.002 inch (2.2098 x 2.54 ±0.0508 mm).
2.
Chip thickness:
.010 ±.0015 inch (0.254 ±0.0381 mm) nominal.
3.
Top metal:
Aluminum 30,000Å minimum, 33,000Å nominal.
4.
Back metal:
A. Al / Ti / Ni / Ag: 12kÅ / 3kÅ / 7kÅ / 7kÅ minimum, 15kÅ / 5kÅ / 10kÅ / 10kÅ nominal.
B. Gold: 2,500Å minimum, 3,000Å nominal.
5.
Backside:
Collector.
6.
Bonding pad:
B1 = .016 x .014 inch (0.4064 x 0.3556 mm),
B2 = .016 x .018 inch (0.4064 x 0.4572 mm),
and E = .040 x .008 inch (1.016 x 0.2032 mm).
FIGURE 3. Physical dimensions for die JANHC (A-version).
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