MIL-PRF-19500/590K
4.3 Screening (JANS, JANTX, and JANTXV levels). Screening shall be in accordance with appendix E, table E-IV
of MIL-PRF-19500, and as specified herein. The following measurements shall be made in accordance with table I
herein. Devices that exceed the limits of table I herein shall not be acceptable.
Screen (see appendix
Measurement
E, table E-IV of
JANS level
JANTXV and JANTX level
1a
Required
Not required
1b
Required
Required (JANTXV only)
2
Optional
Optional
3a
Required
Required
(1) 3c
Thermal impedance (see 4.3.1)
Thermal impedance (see 4.3.1)
4
Not applicable
Not applicable
5
Not applicable
Not applicable
6
Not applicable
Not applicable
7a
Not applicable
Not applicable
7b
Optional
Optional
8
Required
Not required
Required IR1 and VFM1
9
Not required
Method 1038 of MIL-STD-750, condition A
Method 1038 of MIL-STD-750, condition A
10
IR1 and VFM1, ĆIR1 = ±400 nA dc (±800 nA
11
IR1 and VFM1
dc for 1N6631) or 100 percent of initial
reading; whichever is greater.
ĆVFM1 ≤ ± 0.05 V dc
12
Required, see 4.3.2
Required, see 4.3.2
(2) 13
Subgroups 2 and 3 of table I herein:
Subgroup 2 of table I herein:
ĆIR1 = ±400 nA dc (±800 nA dc for 1N6631)
ĆIR1 = ±400 nA dc (±800 nA dc for
or 100 percent of initial reading; whichever is 1N6631) or 100 percent of initial reading;
greater;
whichever is greater;
ĆVFM1 = ±0.05 V dc; scope display
ĆVFM1 = ±0.05 V dc; scope display
evaluation, method 4023 of MIL-STD-750,
evaluation, method 4023 of MIL-STD-750,
see 4.5.4
see 4.5.4
14a
Not applicable
Not applicable
(3) 14b
Required
Required
15
Required
Not required
16
Required
Not required
(1) Shall be performed anytime after temperature cycling, screen 3a; JANTX and JANTXV levels do not need
to be repeated in screen 13.
(2) For glass diodes, the hermetic seal (gross leak) may be performed any time after temperature cycling.
4.3.1 Thermal impedance. The thermal impedance measurements shall be performed in accordance with method
3101 or 4081 as applicable of MIL-STD-750 using the guidelines in that method for determining IM, IH, tH, and K
factor where appropriate). Measurement delay time (tMD) = 70 µs max. See group E, subgroup 4and figures 3 and
4 herein.
4.3.2 Free air power burn-in conditions. Power burn-in conditions are as follows (see 4.5.3.1): TA = +55°C
maximum. Test conditions in accordance with method 1038 of MIL-STD-750, condition B. Adjust IO or TA to achieve
the required TJ. Use method 3100 of MIL-STD-750 to measure TJ. TJ = +115°C minimum and +150°C maximum.
With approval of the qualifying activity and preparing activity, alternate burn-in criteria (hours, bias conditions, TJ,
mounting conditions) may be used for JANTX and JANTXV quality levels. A justification demonstrating equivalence
is required. In addition, the manufacturing site's burn-in data and performance history will be essential criteria for
burn-in modification approval.
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