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MIL-PRF-19500-595 Semiconductor Device, Repetitive Avalanche, Field Effect, Transistor, P-Channel, Silicon, Types 2N7236, 2N7237, 2N7236U, And 2N7237U, Jan, Jantx, Jantxv, Jans, Janhc, And JankcThis specification covers the performance requirements for a P-channel, enhancement-mode, MOSFET, power transistor intended for use in high density power switching applications. Four levels of product assurance are provided for each encapsulated device type as specified in MIL-PRF-19500, and two levels of product assurance for each unencapsulated device type die, with avalanche energy ratings \(EAS and EAR\) and maximum avalanche current \(IAR\).

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MIL-PRF-19500/595K
4.4.2 Group B inspection. Group B inspection shall be conducted in accordance with the conditions specified for
subgroup testing in table E-VIA (JANS) and table E-VIB (JAN, JANTX, and JANTXV) of MIL-PRF-19500 and as
follows. Electrical measurements (end-points) shall be in accordance with table I, subgroup 2 herein.
4.4.2.1 Group B inspection, table E-VIA (JANS) of MIL-PRF-19500.
Subgroup
Method
Condition
B3
1051
Test condition G.
B3
2037
Test condition D. All internal wires for each device shall be pulled separately. If
group B3 is to be continued to C6, strength test may be performed after C6.
B4
1042
Test condition D. The heating cycle shall be 1 minute minimum. No
heat sink nor forced air cooling on the device shall be permitted during the "on" cycle.
B5
1042
A separate sample may be pulled for each test. Accelerated steady-state reverse
bias; test condition A, VDS = rated, TA = +175C, t = 120 hours, read and record
VBR(DSS) (pre and post) at ID = -1 mA dc. Read and record IDSS (pre and post) in
accordance with table I, subgroup 2 herein. VBR(DSS) delta cannot exceed 10 percent.
B5
2037
Bond strength; test condition D.
B6
Not applicable.
4.4.2.2 Group B inspection, table E-VIB (JAN, JANTX and JANTXV) of MIL-PRF-19500.
Subgroup
Method
Condition
B2
1051
Test condition G.
B3
1042
Test condition D. The heating cycle shall be 1 minute minimum.
4.4.3 Group C inspection. Group C inspection shall be conducted in accordance with the conditions specified for
subgroup testing in table E-VII of MIL-PRF-19500, and as follows. Electrical measurements (end-points) shall be in
accordance with table I, subgroup 2 herein.
Subgroup
Method
Conditions
C2
2036
Test condition A; weight = 10 pounds, t = 10 s (not applicable for surface mount
devices).
See 4.3.4, RJC(max) = 1.0C/W.
C5
3161
C6
1042
Test condition D. The heating cycle shall be 1 minute minimum.
4.4.4 Group E inspection. Group E inspection shall be conducted in accordance with the conditions specified for
subgroup testing in table E-IX of MIL-PRF-19500 and as specified in table II herein. Electrical measurements (end-
points) shall be in accordance with table I, subgroup 2 herein.
4.5 Methods of inspection. Methods of inspection shall be as specified in the appropriate tables and as follows.
4.5.1 Pulse measurements. Conditions for pulse measurement shall be as specified in section 4 of MIL-STD-750.
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