MIL-PRF-19500/182H
* TABLE I. Group A inspection.
Inspection 1/
MIL-STD-750
Limit
Unit
Symbol
Method
Conditions
Min
Max
Subgroup 1 2/
Solderability
2026
n = 15 leads, c = 0
Resistance to solvents 3/
1022
n = 15 devices, c = 0
Temp cycling
1051
Test condition C, 25 cycles.
n = 22 devices, c = 0
Hermetic seal 4/
1071
n = 22 devices, c = 0
Fine leak
Gross leak
Electrical measurements
Table I, subgroup 2
Bond strength
2037
Precondition
TA = +250°C at t = 24 hours or
TA = +300°C at t = 2 hours,
n = 11 wires, c = 0
Decap internal visual (design
2075
n = 4 devices, c = 0
verification)
Subgroup 2
Thermal impedance
3131
See 4.3.2
°C/W
ZθJX
3036
100
Collector to base cutoff current
µA dc
Bias condition D, VCB = 120 V dc
ICBO1
pulsed (see 4.5.1).
Emitter to base cutoff current
3061
100
µA dc
Bias condition D, VEB = 7 V dc
IEBO1
pulsed (see 4.5.1).
Breakdown voltage, collector-
3011
80
V dc
Bias condition D; IC = 30 mA dc;
V(BR)CEO
emitter
pulsed (see 4.5.1)
Breakdown voltage
3011
100
V dc
Bias condition D, IC = 10 mA dc,
V(BR)CER
collector-emitter
Collector to base cutoff current
3036
10
nA dc
Bias condition D, VCB = 90 V dc
ICBO2
Emitter-base cutoff current
3061
10
nA dc
Bias condition D, VEB = 5 V dc
IEBO2
Collector-emitter
3071
5.0
V dc
IC = 150 mA dc, IB = 15 mA dc,
VCE(sat)1
saturated voltage
pulsed (see 4.5.1)
See footnotes at end of table.
11
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